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 Edge818 Octal 18V Pin Electronics Driver/window Comparator
EDGE HIGH-PERFORMANCE PRODUCTS Description
The Edge818 is an octal pin electronics driver and window comparator fabricated in a wide voltage CMOS process. It is designed specifically for Test During Burn In (TDBI) applications, where cost, functional density, and power are all at a premium. The Edge818 incorporates eight channels of programmable drivers and window comparators into one 14 mm X 20 mm 100 pin MQFP package. Each channel has per pin driver levels, data, and high impedance control. In addition, each comparator has per pin high and low threshold levels. The Edge818 uses "Flex In" and "Flex Out" digital inputs, and can therefore mate directly with any digital technology providing a minimum 2V swing. The digital outputs can mate directly with any digital technology. The 18V driver output and receiver input range allow the Edge818 to interface directly with TTL, ECL, CMOS (3V, 5V, and 7V), LVCMOS, and custom level circuitry, as well as the high voltage (Super Voltage) level required for many special test modes for Flash Devices.
Features
* * * * * * * 18V I/O Range 50 MHz Operation Per Pin Flexibility Programmable Input Thresholds Flex In Digital Inputs Flex Out Digital Outputs Small footprint (100 pin MQFP)
Applications
* Burn In ATE * Low Cost ATE * Instrumentation
Functional Block Diagram
VH VL
DATA EN*
8 8
8
DOUT
QA COMP HIGH COMP LOW QB
8
- +
8
CVA
8
VINP
8
+ -
8 CVB
Revision 1/ May 23, 2000
1
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Edge818
EDGE HIGH-PERFORMANCE PRODUCTS PIN Description
Pin Name DATA (0:7) Pin Number 100, 4, 8, 12, 19, 23, 27, 31 Description Digital inputs which determine the high/low state of the driver, when it is enabled. Digital inputs wihch enable/disable the driver. Comparator digital outputs.
EN* (0:7) QA (0:7) QB (0:7) DOUT (0:7)
3, 7, 11, 15, 16, 20, 24, 28 1, 5, 9, 13, 18, 22, 26, 30 2, 6, 10, 14, 17, 21, 25, 29 79, 75, 71, 67, 64, 60, 56, 52
Driver Outputs.
VINP (0:7) VH (0:7)
81, 77, 73, 69, 62, 58, 54, 50 80, 76, 72, 68, 63, 59, 55, 51
Comparator Inputs. Unbuffered analog inputs that set the driver "high" voltage level. Unbuffered analog inputs that set the driver "low" voltage level. Analog inputs that set the threshold for the A comparators.
VL (0:7)
78, 74, 70, 66, 65, 61, 57, 53
CVA (0:7)
97, 95, 89, 87, 44, 42, 36, 34
CVB (0:7) VBB
96, 94, 88, 86, 45, 43, 37, 35 46, 85
Analog inputs that set the threshold for the B comparators. Analog input voltage that sets the threshold for the digital inputs. Unbuffered analog input that sets the high level of the comparator outputs. Unbuffered analog input that sets the low level of the comparator outputs. Positive power supply.
COMP HIGH
33, 98
COMP LOW
32, 99
VCC
40, 41, 47, 49, 82, 84, 90, 91
VEE
38, 39, 48, 83, 92, 93
Negative power supply.
2000 Semtech Corp.
2
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Edge818
EDGE HIGH-PERFORMANCE PRODUCTS PIN Description (continued)
COMP HIGH
COMP LOW
DATA0
81 QA0 QB0 EN*0 DATA1 QA1 QB1 EN*1 DATA2 QA2 QB2 EN*2 DATA3 QA3 QB3 EN*3 EN*4 QB4 QA4 DATA4 EN*5 QB5 QA5 DATA5 EN*6 QB6 QA6 DATA6 EN*7 QB7 QA7 31 51 1 VH0 DOUT0 VL0 VINP1 VH1 DOUT1 VL1 VINP2 VH2 DOUT2 VL2 VINP3 VH3 DOUT3 VL3 VL4 DOUT4 VH4 VINP4 VL5 DOUT5 VH5 VINP5 VL6 DOUT6 VH6 VINP6 VL7 DOUT7 VH7
100 Lead - 14 x 20 MQFP
DATA7
VEE
COMP LOW
VEE
VBB
CVA7
CVA6
CVA5
COMP HIGH
CVB7
CVB6
CVA4
VCC
VCC
VEE
2000 Semtech Corp.
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VINP7
CVB5
CVB4
VCC
VCC
VINP0
CVB0
CVB1
CVB2
CVB3
CVA0
CVA1
CVA2
CVA3
VCC
VCC
VCC
VCC
VEE
VEE
VBB
VEE
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Edge818
EDGE HIGH-PERFORMANCE PRODUCTS Circuit Description
Driver Description The Edge818 supports programmable high and low levels and tristate per channel. There are no shared lines between any drivers. The EN* and DATA signals are wide voltage high impedance analog inputs capable of receiving digital signals over a wide common mode range. VBB is the high impedance analog input which sets the threshold for EN* and DATA. EN*, DATA > VBB < VBB Status "1" "0"
VL VH
DUT
Figure 3. Simplified Model of the Unbuffered Output Stage
With EN* high, the driver goes into a high impedance state. With EN* low, DATA high forces the driver into a high state, and DATA low forces the driver into a low state. EN* 1 0 0 DATA X 1 0 DOUT HiZ VH VL
Driver Output Protection In a functional testing environment, where a resistor is added in series with the driver output to create a 50 driver, the Edge818 can withstand a short to any legal voltage for an indefinite amount of time. In a low impedance application, with no additional output resistance, the system should be designed to check for a short circuit prior to connecting the driver, and tristate the driver if a short is detected.
Drive High and Low VH and VL define the logical "1" and "0" levels of the driver, and can be adjusted anywhere over the range determined by VCC and VEE. There are no restrictions between VH and VL, other than they must remain within the power supply levels. VEE VH VCC VEE VL VCC The VH and VL inputs are unbuffered in that they also provide the driver output current (see Figure 3), so the source of VH and VL must have ample current drive capability.
Receiver Description The Edge818 supports a window comparator with independent threshold levels per channel. There are no shared comparator lines between channels. CVA and CVB are high impedance analog voltage inputs which define the threshold voltages for comparators A and B. If VINP is more positive than CVA or CVB, QA and QB will be high. Otherwise, QA and QB will be low. VINP VINP > CVA VINP < CVA VINP VINP > CVB VINP < CVB QA COMP HIGH COMP LOW QB COMP HIGH COMP LOW
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2000 Semtech Corp.
4
Edge818
EDGE HIGH-PERFORMANCE PRODUCTS Circuit Description (continued)
The comparator outputs are "Flex Out". They are technology independent and may be adjusted over a wide voltage common mode range. COMP HIGH and COMP LOW are analog inputs which set the digital high and low levels (respectively) of QA and QB. COMP HIGH and COMP LOW are unbuffered inputs that provide the necessary drive current, so the sources for these levels must have adequate current capability.
COMP HIGH
QAX, QBX
COMP LOW
Figure 4. Simplified Model of the Unbuffered Comparator Output Stage
Typically, COMP HIGH and COMP LOW will be connected to the digital power supplies of the chip receiving QA and QB. Receiver Headroom There is ~2V of headroom required between the comparator thresholds and both power supply levels. VEE + 2.0 CVA, CVB VCC - 2.0
2000 Semtech Corp.
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Edge818
EDGE HIGH-PERFORMANCE PRODUCTS Application Information
Power Supply Decoupling VCC and VEE should be decoupled to GND with a .1 F chip capacitor in parallel with a .001 F chip capacitor. A VCC and VEE plane, or at least a solid power bus, is recommended for optimal performance. VH and VL Decoupling As the VH and VL inputs are unbuffered and supply the driver output current, which can be quite large during edge transitions, decoupling capacitors for these inputs are recommended in proportion to the amount of output current requirements. For applications where VH and VL are shared over multiple channels, a solid power plane to distribute these levels is preferred. VBB The two VBB pins are connected together on-chip. Therefore, only one VBB needs to be connected to for proper 818 operation. The two pins may be used to daisy chain a VBB signal across a PC Board without having to route the actual signal underneath the 818. Latchup Protection The Edge818 has several power supply requirements to protect the part in power supply fault situations, as well as during power up and power down sequences. VCC must remain greater than or equal to VDD (external supply for the digital logic) at all times. Both VCC and VDD
VEE VCC
must always be positive (above ground), and VEE must always be negative (at or below ground). The three diode configuration shown in Figure 5 should be used on a once-per-board basis.
VDD 1N5820 or Equivalent
Figure 5. Power Supply Protection Scheme
gure 5. Warning: It is extremely important that the voltage on any device pin does not exceed the range of VEE - 0.5V to VCC +0.5V at any time, either during power up, normal operation, or during power down. Failure to adhere to this requirement could result in latchup of the device, which could be destructive if the system power supplies are capable of supplying large amounts of current. Even if the device is not immediately destroyed, the cumulative damage caused by the stress of repeated latchup may affect device reliability.
2000 Semtech Corp.
6
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Edge818
EDGE HIGH-PERFORMANCE PRODUCTS Package Information
100-Pin MQFP 14 mm x 20 mm
4 D D2 Z D -D- 3
PIN Descriptions
4X
0.25
C
A-B
D
3 e
-A-
-B-
3
E2 -E- 4
Z
E
SEE DETAIL "A"
TOP VIEW
2 4X
5
7 0.20 C A-B 5 D1 D 7
5
7
E1
O
O
BOTTOM VIEW
2000 Semtech Corp.
7
C
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Edge818
EDGE HIGH-PERFORMANCE PRODUCTS Package Information (continued)
0.40 MIN. 0 MIN.
e/2
A2 - 0.10 S 0.13 / 0.30 R. TYP. 0.13 R. MIN. C
-A, B, D-
3
GAGE PLANE
C
DETAIL "A"
A1 BASE PLANE SEATING PLANE 1.60 REF.
L
0.25
0-7
DETAIL "B"
12 - 16 1.28 REF.
SEE DETAIL "B" A B -H- 2 0.076 -C- 12 0.13 / 0.23
8
ccc
M
C A-B S D S
WITH LEAD FINISH
0.13 / 0.17
12 - 16
SECTION C-C
B
1 BASE METAL
Variations (all dimensions in millimeters) Notes: 1. All dimensions and tolerances conform to ANSI Y14.5-1982. 2. Datum plane -H- located at mold parting line and coincident with lead, where lead exits plastic body at bottom of parting line. 3. Datums A-B and -D- to be determined where centerline between leads exits plastic body at datum plane -H-. 4. To be determined at seating plane -C-. 5. Dimensions D1 and E1 do not include mold protrusion. Allowable mold protrusion is 0.254 mm per side. Dimensions D1 and E1 do include mold mismatch and are determined at datum plane -H-. 6. "N" is the total # of terminals. 7. Package top dimensions are smaller than bottom dimensions and top of package will not overhang bottom of package. 8. Dimension B does not include dambar protrusion. Allowable dambar protrusion shall be 0.08 mm total in excess of the dimension at maximum material condition. Dambar cannot be located on the lowerradius or the foot. 9. All dimensions are in millimeters. 10. Maximum allowable die thickness to be assembled in this package family is 0.635 millimeters. 11. This drawing conforms to JEDEC registered outlines MS-108 and MS-022. 12. These dimensions apply to the flat section of the lead between 0.10 mm and 0.25 mm from the lead tip. 2000 Semtech Corp. 8
Symbol A A1 A2 D D1 D2 ZD E E1 E2 ZE L N e B B1 ccc ND NE 0.22 0.22 0.30 0.13 30 20 Side Pin Count Side Pin Count 0.73 0.25 2.57 Min Nom 3.04 0.33 2.71 23.20 BSC 20.00 BSC 18.85 REF 0.58 REF 17.20 14.00 BSC 12.35 REF 0.83 REF 0.88 100 0.65 BSC 0.38 0.33 8 1.03 6 Pin Count Lead Pitch Pad Dimension Pad Dimension 4 5 Body Dimension 2.87 4 5 Body Dimension Max 3.40 Note Comments Height above PCB Gap above PCB Body Thickness
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Edge818
EDGE HIGH-PERFORMANCE PRODUCTS Recommended Operating Conditions
Parameter Total Analog Supply Ambient Operating Temperature Junction Temperature Symbol VCC - VEE TA TJ Min 12.0 Typ Max 18.0 +70 +125 Units V
oC oC
Absolute Maximum Ratings
Parameter Total Power Supply Digital Input Voltages Analog Input Voltages Analog Output Voltages Symbol VCC - VEE DATA, EN* VH, VL, CVA, CVB, VINP, VBB DOUT, COMP HIGH, COMP LOW Min -0.5 VEE - .5 VEE - .5 VEE - .5 Max 19.0 VCC + .5 VCC + .5 VCC + .5 Units V V V V
Ambient Operating Temperature Storage Temperature Junction Temperature Soldering Temperature (5 seconds, .25" from the pin)
TA TS TJ TSOL
-50 -65
+125 +150 +150 +260
oC oC oC oC
Stresses above those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress rating only, and functional operation of the device at these, or any other conditions beyond those listed, is not implied. Exposure to absolute maximum conditions for extended periods may affect device reliability.
2000 Semtech Corp.
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Edge818
EDGE HIGH-PERFORMANCE PRODUCTS DC Characteristics
Parameter Driver High Voltage Low Voltage Output Swing HiZ Leakage Current Output Impedance DC Output Current (Note 1) AC Output Current (Note 2) Receiver Input Voltage Range Threshold Voltage Range Offset Voltage (Note 3) Input Bias Current Output Voltage Range QA, QB Output Impedance DC Output Current Capability Digital Inputs Input High Voltage Input Low Voltage Input Current Power Supplies Positive Supply Level Negative Supply Level Positive Supply Current Negative Supply Current VCC VEE ICC IEE 36 36 +15.0 -3.0 57 57 78 78 V V mA mA EN*, DATA - VBB VBB - EN*, DATA Iin 1.0 1.0 -100 V V nA VINP CVA, CVB Vos Ibias COMP HIGH COMP LOW Rout VEE VEE + 3.0 -200 -10 -2.0 -2.0 30 -50 40 VCC VCC - 3.0 +100 +10.0 +5.0 +5.0 50 50 V V mV nA V V mA VH VL VH - VL Ileak Rout Iout DC Iout AC VEE VEE VEE -2.0 9.0 -125 -400 VCC VCC VCC +2.0 15 +125 +400 V V V nA mA mA Symbol Min Typ Max Units
0 12
0
0
+100
Test conditions (unless otherwise specified): "Recommended Operating Conditions". Note 1: Note 2: Note 3: DC output current is specified per individual driver. Surge current capability for durations of < 2 seconds. Offset voltage is tested at CVA, CVB = 1.5V.
2000 Semtech Corp.
10
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Edge818
EDGE HIGH-PERFORMANCE PRODUCTS AC Characteristics
Parameter Driver DATA to DOUT EN* to DOUT (Active to HiZ) (Note 1) EN* to DOUT (HiZ to Active) Rise/Fall Times (Note 2) 1V Swing (20% - 80%) 3V Swing (10% - 90%) 5V Swing (10% - 90%) 10V Swing (10% - 90%) 15V Swing (10% - 90%) Maximum Operating Frequency (Note 3) Minimum Pulse Width Receiver Comparator Tpd+ TpdMaximum Operating Frequency (Note 3) Minimum Pulse Width 700 ps Fmax 11.5 14.5 50 10 15 17.5 20.5 19.5 23.5 ns ns MHz ns Tpd Tpd Tpd Tr/Tf Tr/Tf Tr/Tf Tr/Tf Tr/Tf Fmax 50 8 11 9.5 10 11 14.5 20 16 1.5 1.9 2.0 2.5 3.2 19.5 30 21 ns ns ns ns ns ns ns ns MHz ns Symbol Min Typ Max Units
Test conditions (unless otherwise specified): "Recommended Operating Conditions". Note 1: Note 2: Note 3: Load = 10 mA and measured when a 1V change at the output is detected. (VH = 3V, VL = 0V, VFLOAT = 1.5V, tested at 1V and 2V.) Into 18 cm of 50 transmission line terminate with 1 K, with proper series termination resistor.Guaranteed by characterization. This parameter is not tested in production. This parameter is production tested at 40 MHz.
2000 Semtech Corp.
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Edge818
EDGE HIGH-PERFORMANCE PRODUCTS Ordering Information
Model Number E818AHF
Package 100 Lead MQFP 14 mm x 20 mm Body Size w/Internal Heat Spreader
EVM818AHF
Edge818 Evaluation Board
Contact Information
Semtech Corporation Edge High-Performance Division 10021 Willow Creek Rd., San Diego, CA 92131 Phone: (858)695-1808 FAX (858)695-2633
2000 Semtech Corp. 12 www.semtech.com


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